Abstract
In the present paper, scanning and transmission electron microscopies aswell as energy dispersive X-ray spectroscopy investigations were performedto describe the morphology and chemical composition of the intermetallic phasesgrowing in Cu/Sn/Cu and Cu(Ni)/Sn/Cu(Ni) interconnectionsduring the diffusion soldering process. The obtained results revealed thateven a small amount of Ni addition (5 at-%) to the Cu substratetotally changes the morphology and the rate of formation of the intermetallicphase layers in the solder/substrate reaction zone of the interconnectionsprepared at the same time and joining temperature conditions. The presentedstudies are promising in terms of the shortening of the soldering time inthe electronic industry.
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