Abstract
In this paper, two integration technologies are discussed for heterogeneously integrated microsystems. First, this paper presents low-loss TSVs using an air-isolation technique for silicon interposers. The proposed air-isolated TSVs exhibit approximately 35% and 37% reduction in insertion loss and capacitance, respectively, at 20 GHz. Moreover, this paper presents a TSV-less integration technology using bridge chips and Compressible MicroInterconnects (CMIs). Compared to other packaging and assembly options, the investigated TSV-less approach provides monolithic-like electrical performance by significantly reducing chip-to-chip interconnect length and loss, increasing interconnect density, and providing the ability to seamlessly integrate chips of diverse functionalities.
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