Abstract
What we believe to be a novel fabrication process for monolithic full-color (RGB) micro-LED (µLED) display technology, featuring three-dimensional (3D) and quantum dot (QD)-based color conversion layer, has been proposed. This method offers advantages such as a wide color gamut, high pixel density, high yield, and low cost. A 16 × 16 passive matrix (PM) RGB µLED array, with a pitch size of 80 µm and a pixel density of 328 pixels per inch (PPI), has been successfully realized using flip-chip bonding technology. When measuring the electroluminescence (EL) spectra of the green and red pixels with the addition of color filters, the color gamut can achieve a maximum of 124% of the National Television System Committee (NTSC) standard. Additionally, this process significantly reduces the risk of damage to the QD film during photolithography compared to using two different colored QDs for RGB µLED arrays. The proposed manufacturing process shows considerable promise for commercialization.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
