Molecular dynamics simulation study of thermodynamic and mechanical properties of the Cu–Pd random alloy

Abstract

Molecular dynamics (MD) simulations have been performed to investigate the thermodynamic and mechanical properties of Cu– x% Pd (at%) random alloy, as well as those of the Cu 3Pd and CuPd 3 ordered alloys, in the temperature range from 200 K up to the melting point. The quantum Sutton-Chen (Q-SC) many-body interatomic potentials have been used to describe the energetics of the Cu and Pd pure metals, and a standard mixing rule has been employed to obtain the potential parameters for the mixed (alloy) states. We have computed the variation of the melting temperature with the concentration of Pd. Furthermore, the variation of the cohesive energy, the order parameter, the thermal expansion coefficient, the density, the isobaric heat capacity, the bulk modulus, and the elastic stiffness constants were also calculated at different temperatures and concentrations for these materials. The computed variations of the thermodynamic and mechanical properties with temperature are fitted to a polynomial function. Our computed results show good agreement with other computational simulations, as well as with the experimental results where they have been available.