Abstract
AbstractThe molecular depth profiling of polymer by the electrospray droplet impact (EDI) has been performed. The multiply charged water droplets with kinetic energy of ∼106 eV were irradiated on the polystyrene spin coated on silicon wafer. With EDI etching, the ablation of the target is suppressed to a minimal, i.e. the shallow surface etching with nonrecognizable damage on the surface is realized. It was found that EDI/SIMS spectra and EDI/XPS spectra for polystyrene (PS) has shown no damage accumulation on the surface. This indicates that EDI is a unique technique for surface etching of polymer materials without causing any damage to the etched surface. Copyright © 2010 John Wiley & Sons, Ltd.
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