Abstract
A unique molded chip scale (CSP) associated 1024 pin counts has been developed. This has the bare die soldering feature, that means highest mount density and enhanced electrical characteristic, and the robust package feature, that means easy to handle, to test and to standardize such as known good die (KGD). The wiring conductor patterns made of copper realized enhanced electrical characteristic. The solder bumping process with screen printing technique, was applied with cost competitiveness. And the transfer molding process produced high reliable package.
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