Abstract
For the Large Hadron Collider (LHC) Phase 2 upgrade ATLAS will replace its current inner detector with an all-silicon Inner Tracker (ITk) to achieve high performance in a very high occupancy and radiation environment. The ITk consists of strip and pixel modules. Here the focus is placed on the assembly and testing procedures needed to assure the quality of the pixel modules to be installed in the detector. Ongoing developments and activities are discussed, e.g. with a special focus on the effect of mechanical stress in the connection of sensor and readout chip in the module due to thermal effects.
Highlights
Despite the fact that module assembly and testing processes are well defined and advanced, they will need to be adjusted once the final module dimensions and readout systems are know
Possible solutions for the reduction of mechanical stress in the bump bonds to avoid disconnections during thermal cycles are under test and results are expected soon
The project is on its way for installing ITk in ATLAS in the long shut down 3 of the LHC (2024-2026)
Summary
All pixel modules are hybrids of a sensor connected to a readout chip via bump bonds, forming the so called bare module. Wire bonds to the flex connect the readout chips and the sensor of the module to the off-detector electronics such as the readout system or the bias voltage supplies. 3.1 Module assembly The module assembly consists of two parts: gluing the flex to the bare module and wire bonding the readout chip to the flex with encapsulation of the bonds afterwards. With the glue applied to the flex, the flex is aligned to the bare module by dowel pins and holes in the jigs. After the glue is cured the readout chip and the flex are connected with wire bonds. For the upcoming module building with RD53A readout chips the design is adapted to the dimensions of the used components
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