Abstract
Purpose – Anisotropic conductive adhesive film (ACF) is used for very fine pitch applications in the microelectronics industry, such as flip chip (FC) technology. During the bonding process, bumps on the chip and pads on the substrate are first aligned and then heat and pressure are applied so as to apply thermal energy to the ACF for curing and to cause permanent plastic deformation of the conductive particles. Consequently, a permanent electrical and mechanical contact is formed between the bumps and the pads. The purpose of this study is to investigate the effect of the size and location of any voids in the ACF during subsequent solder reflow processes necessary for SMT component attachment. The paper also investigates the use of a protective aluminium cover during such reflow cycles, which reduces the temperature inside the ACF, and therefore, the stresses inside the ACF, especially when voids exist.
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