Abstract
A 3D thermal transient analysis of a gap profiling technique which utilises phase change material (plasticine) is conducted in ANSYS. Phase change is modelled by assigning enthalpy of fusion over a wide temperature range based on Differential Scanning Calorimetry (DSC) results. Temperature dependent convection is approximated using Nusselt number correlations. A parametric study is conducted on the thermal contact conductance value between the profiling device (polymer) and adjacent (metal) surfaces. Initial temperatures are established using a liner extrapolation based on experimental data. Results yield good correlation with experimental data.
Highlights
Manufacture and assembly of structures is a complex process wherein the final stages of assembly gaps may be found between mating surfaces of components that are to be mechanically-fastened[1]
This paper aims to model in ANSYS v11.0, the various transient thermal processes involved during the cooling of the Gap Sachet, including the phase change of plasticine and the effect of thermal contact conductance between a polymer-metal interface
As the injection hole has not been modelled on the conv1 face, the plasticine within the Gap Sachet is not directly exposed to convection in the computational model, under predicting the drop in temperature after filling of the Gap Sachet has been completed at 1.7 seconds
Summary
Manufacture and assembly of structures is a complex process wherein the final stages of assembly gaps may be found between mating surfaces of components that are to be mechanically-fastened[1]. The gaps arise due to an individual component’s manufacturing tolerances, which when placed in their respective final positions present significant deviations from their nominal dimensions due to the summation of the individual variations. These gap heights typically range from 0 to 2.5 mm. The Gap Sachet (Figure 1) is a device created for the purpose of profiling gaps arising between mating faces of components and is intended for use in conjunction with one of the many 3D surface digitizing technologies for digital mapping[4]. The plasticine within the Gap Sachet is allowed to cool and upon hardening it is removed providing a sectional profile of the gap
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
