Abstract
Nano–finishing is one of the emerging fields in the area of manufacturing. In the present era, nano–finished components are being developed by two different ways, i.e. soft loop as well as hard loop process; whereas soft loop process is widely used in industries. Recently, a novel nano–finishing process has been developed by combination of magnetorheological finishing (MRF) and chemo mechanical polishing (CMP), which is named as chemo–mechanical magnetorheological finishing (CMMRF) process. CMMRF process has been developed for nanofinishing of silicon and copper. Finishing parameters of CMMRF have not been studied theoretically. It is identified that the polishing pressure is a key factor of soft loop process. Hence, an analytical approach has been taken to study polishing pressure in CMMRF. In this work, a mathematical model has been developed to understand the finishing mechanism and to investigate polishing pressure with other controlling parameters. The model has been simulated and subsequently validated using experimentation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
