Abstract
Hot via technology plays an important role for system integration at millimeter-wave frequencies. Accurate prediction of the parasitics is necessary to ensure proper impedance matching for system applications. In this paper, we report the characterization of hot-via interconnect for system-in-package (SiP) applications at millimeter-wave frequencies. A test structure using microstrip to grounded coplanar waveguide (GCPW) transition has been characterized to extract the equivalent circuit model of the hot-via. The model demonstrates an excellent agreement with measurements up to 50 GHz.
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