MOD법으로 제조된 Copper Manganite 박막의 구조 및 NTCR 특성

Abstract

Copper manganite thin films were fabricated on <TEX>$SiN_x/Si$</TEX> substrate by metal organic decomposition (MOD) process. They were burned-out at <TEX>$400^{\circ}C$</TEX> and annealed at various temperatures (<TEX>$400{\sim}800^{\circ}C$</TEX>) for 1h in ambient atmosphere. Their micro-structure and negative temperature coefficient of resistance (NTCR) characteristics were analyzed for micro-bolometer application. The copper manganite film with a cubic spinel structure was well developed at <TEX>$500^{\circ}C$</TEX> which confirmed by XRD and HRTEM analysis. It showed a low resistivity (<TEX>$47.5{\Omega}{\cdot}cm$</TEX>) at room temperature and high NTCR characteristics of <TEX>$-4.12%/^{\circ}C$</TEX> and <TEX>$-2.15%/^{\circ}C$</TEX> at room temperature and <TEX>$85^{\circ}C$</TEX>, implying a good thin film for micro-bolometer application. Furthermore, its crystallinity was enhanced with increasing temperature to <TEX>$600^{\circ}C$</TEX>. However, the appearance of secondary phase at temperatures higher than <TEX>$600^{\circ}C$</TEX> lead to deteriorate the NTCR characteristics.