Abstract
IC foundries such as UMC have adopted a combined electromagnetic field-electrical circuit simulation approach for modeling on-chip passive interconnect structures. This approach provides an accurate method for characterizing the frequency response of 3D structures such as spiral inductors. Using 3D electromagnetic field simulation provides an accurate characterization of the frequency response of the spiral. The frequency response of the S-parameters is evaluated as a reduced order circuit model that is combined with SPICE files to provide electromagnetically accurate circuit behavior used in chip level simulations.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
