Abstract
New porous ULK materials are now required for maintaining a constant RC factor as back-end dimensions shrink for each new technology node. Porous SiOCH ULK HF characterization, dedicated to the 32 nm node, has been performed, and its complex permittivity extracted up to 8 GHz. The impact of process integration on the porous SiOCH is highlighted, by an increase of its real permittivity and unwanted losses.
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