Abstract
In this paper, the Ti2AlNb alloy was bonded to TC4 alloy using the vacuum diffusion bonding method with a Ti interlayer. The interfacial microstructure of the Ti2AlNb/Ti/TC4 joint was characterized. The relationship between the bonding parameters and the microstructure and mechanical property of the joints was explored. Results indicated that the interdiffusion of Nb and Al elements between the interlayer and substrates promoted the formation of the lamellar α + β dual-phase structure in the joint. The bonding parameters determined the diffusion distance of Nb and Al elements, thus controlling the characteristics of the lamellar α + β dual-phase structure. When the Ti2AlNb alloy and TC4 alloy were bonded at 950 °C for 30 min under a pressure of 10 MPa, the elemental diffusion in the bonding couple was sufficient and the joint possessed the maximum shear strength of 549 MPa.
Highlights
Introduction and Mechanical Properties of VacuumIn 1960, researchers found that adding an appropriate amount of Nb in a Ti3 Al-based alloy could develop a new kind of alloy, i.e., the Ti2 AlNb alloy, which possesses high specific strength, excellent creep resistance, and oxidation resistance [1,2,3,4,5,6]
Ti2 AlNb alloy and TC4 alloy, they have been regarded as promising structural materials in the aerospace industry [9,10]
When the Ti2 AlNb alloy and TC4 alloy are direct diffusion bonded, a high bonding temperature and a long holding time are often needed to enhance the atomic diffusion at the bonding interfaces, which may be harmful to the base metals
Summary
In 1960, researchers found that adding an appropriate amount of Nb in a Ti3 Al-based alloy could develop a new kind of alloy, i.e., the Ti2 AlNb alloy, which possesses high specific strength, excellent creep resistance, and oxidation resistance [1,2,3,4,5,6]. The joint microstructure can be well controlled to avoid the formation of voids, cracks, and brittle intermetallic compounds. When the Ti2 AlNb alloy and TC4 alloy are direct diffusion bonded, a high bonding temperature and a long holding time are often needed to enhance the atomic diffusion at the bonding interfaces, which may be harmful to the base metals. Diffusion bonding with Ti/Al [28], Ni [29], Ni/Al [30], and Ti/Cu [31] interlayers have been applied to the joining of Ti-based alloys, and sound joints have been obtained without damaging the base metals. To achieve a reliable joint of Ti2 AlNb alloy and TC4 alloy, a suitable interlayer should be chosen It should have an appropriate interdiffusion degree and not form intermetallic compounds with the base metals. The relationship between the microstructural evolution and mechanical performance of the Ti2 AlNb/Ti/TC4 joint is discussed systematically
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