Abstract
Bismuth layer-structured ferroelectric Bi4Ti3O12 thin films have been deposited on n-type Si(111) and Pt(111)/Ti/SiO2/Si substrates using rf-magnetron sputtering process. The effects of substrates and annealing treatments on microstructure and ferroelectric properties were investigated. Scanning electron microscopy and X-ray diffraction patterns exhibited that the as-deposited thin films were noncystalline and transformed to crystalline Bi4Ti3O12 phase with a second phase of Bi12TiO20 after annealed at 700 °C. Ferroelectric properties showed that as-deposited thin film in metal-ferroelectric-semiconductor capacitor form and annealed thin film in metal-ferroelectric-metal form exhibited typical ferroelectric behaviors, wherein the values of remnant polarization were around 0.8 µC/cm2 and 4.8 µC/cm2, respectively.
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