Abstract
Double shear lap joints made with eutectic Sn–Ag solder were cooled from 270 °C at different rates ranging from air-cooling to iced-brine quenching. These joints were subjected to reversed stressing with constant shear strain amplitude at room temperature. Shear strain amplitudes between 0.75 and 1 were imposed during the course of this investigation. Role of microstructural features on the surface damage accumulation and stress–strain behavior was investigated as a function of shear strain amplitude and number of cycles of repeated stressing. Shear banding was found to be along Sn dendrites in air-cooled specimens, while it cut across the small Sn grains present in the quenched specimens.
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