Abstract
Cold spraying is a coating technique in which the formation of dense, tightly bonded coatings occurs only due to the kinetic energy of high velocity particles of the spray powder. These particles are still in the solid state as they impinge on the substrate. This study correlates optimized deposition parameters with the corresponding microstructure as well as mechanical and conductive behavior of cold sprayed copper coatings in order to explain possible bonding mechanisms. In addition, the performance of cold sprayed copper coatings is compared to that of cold rolled copper and to coatings prepared by thermal spray methods.
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