Microsacle PolySilicon Hemispherical Shell Resonating Gyroscopes with Integrated Three-dimensional Curved Electrodes

Abstract

A novel approach for fabrication of polysilicon hemispherical resonator gyroscopes with integrated 3-D curved electrodes is developed and experimentally demonstrated. The 3-D polysilicon electrodes are integrated as a part of the hemispherical shell resonator’s fabrication process, and no extra assembly process are needed, ensuring the symmetry of the shell resonator. The fabrication process and materials used are compatible with the traditional semiconductor process, indicating the gyroscope has a high potential for mass production and commercial development. Without any trimming or tuning of the n=2 wineglass frequencies, a 28 kHz shell resonator demonstrates a 0.009% frequency mismatch between two degenerate wineglass modes, and a 13.6 kHz resonator shows a frequency split of 0.03%. The ring-down time of a fabricated resonator is 0.51 s, corresponding to a Q of 22000, at 0.01 Pa vacuum and room temperature. The prototype of the gyroscope is experimentally analyzed, and the scale factor of the gyro is 1.15 mV/°/s, the bias instability is 80 °/h.