Abstract
A novel micro electroforming process, which targets the cost efficient fabrication of high-aspect-ratio metallic microstructures, is presented in this paper. An insulating mask with patterned features for localizing the deposition region moves periodically along the metal growth direction during electrodeposition instead of the traditional patterned photoresist mask coated on a substrate. The proposed technology offers some unique advantages such as re-using of mask and avoiding removal of photoresist. The current density distribution and metal deposition in the proposed process were studied. Typical high-aspect-ratio metallic microparts in the scale of several hundred microns have been produced.
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