Abstract
Technique of modification of basal faces Pt(hkl) by adatoms and epitaxial copper deposits is developed. Analysis of potentiostatic current transients of copper deposition/dissolution and atomic force microscopy showed that the activity of Pt(hkl) faces regarding the processes of copper nucleation and epitaxial growth increases in the sequence of Pt(111) < Pt(110) < Pt(100). The reaction of nitrate anion reduction is sensitive towards the surface structure, not only in the case of platinum, but also in the case of copper deposits (including a monolayer of adatoms). The highest process rate is observed for the Pt(100) electrode modified by a monolayer of adatoms or islands of bulk copper; nitrate reduction at the lowest rate occurs at Pt(111) + Cu electrodes. Structure-sensitive competitive adsorption of background electrolyte and nitrate anions is the factor that largely determines the kinetics of nitrate reduction on different faces of platinum single crystal and copper deposits.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
