Abstract

Electrodeposition (ED) of photoresist is a promising method to transfer fine patterns onto non-planar, high-topography surfaces. It is especially suited for patterning metal layers to fabricate three dimensional (3D) structures. A newly developed coating system is employed and commercially available photoresists are used. The coating process developed to improve the resolution of the printed images in and across cavities ≥390 μm deep is described and the effect of several parameters investigated. Examples of fabricated truly 3D and novel RF microstructures on silicon wafers, such as solenoid inductors and through-chip transmission lines, are presented.

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