Abstract
We have made many versions of MEMS thermal shearstress sensors and they have been used in many applications successfully. However, it has been found that the classical 1-D theory for conventional thermal shearstress sensors is inapplicable to our MEMS sensors. This paper then presents a systematic study of this issue and for the first time, an adequate theoretical analysis of our sensors is developed and the obtained new model is in excellent agreement with experimental data. It is found that a 2-D MEMS shear stress sensor theory has to be used and it has to include heat transfer effects that are normally ignored by the classical theory. Not only experimentally to confirm this new model, we have also performed 3D heat transfer simulation and the results support the proposed new theory.
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