Abstract
In this brief, we investigate the bidirectional threshold voltage drift ( $\Delta {V}_{T}$ ) following negative-bias temperature instability (NBTI) stress in carbon-doped fully recessed AlGaN/GaN metal–insulator–semiconductor high-electron-mobility transistors (MIS-HEMTs). Several stress conditions were applied at different: 1) gate biases ( ${V}_{GS,STR}$ ); 2) stress times ( ${t}_{STR}$ ); and 3) temperatures ( ${T}$ ). Both negative and positive $\Delta {V}_{T}$ (thermally activated with different activation energies, ${E}_{A}$ ) were observed depending on the magnitude of ${V}_{GS,STR}$ . In accordance with the literature, observed $\Delta {V}_{T} V ( ${E}_{A}~\approx ~0.5$ eV) under moderate stress is attributed to the emission of electrons from oxide and interface traps. Instead, $\Delta {V}_{T} >0$ V ( ${E}_{A}~\approx ~0.9$ eV) under high stress is attributed to the increased negatively ionized acceptor trap density in the buffer associated with carbon doping.
Highlights
GALLIUM Nitride (GaN)-based devices have gained huge popularity in recent years thanks to their outstanding performance in terms of power density and operating frequency compared to Si counterparts for power switching and RF applications [1]
Conventional GaN High Electron Mobility Transistors (HEMTs) are normally-on devices, while normallyoff operation is desirable for commercial devices
We report on an extensive characterization of VT stability in fully recessed AlGaN/GaN MIS-HEMTs under different stress conditions in terms of: i) gate bias (VGS,STR); ii) stress time; and iii) temperature (T)
Summary
GALLIUM Nitride (GaN)-based devices have gained huge popularity in recent years thanks to their outstanding performance in terms of power density and operating frequency compared to Si counterparts for power switching and RF applications [1]. ∆VT > 0 was observed in off-state operating conditions, attributed to a hole generation mechanism [8], [11] For this reason, it is worthwhile performing an in-depth analysis of VT stability after NBTI stress by exploring a wide range of stress conditions to provide a comprehensive explanation for the observed results. It is worthwhile performing an in-depth analysis of VT stability after NBTI stress by exploring a wide range of stress conditions to provide a comprehensive explanation for the observed results In this brief, we report on an extensive characterization of VT stability in fully recessed AlGaN/GaN MIS-HEMTs under different stress conditions in terms of: i) gate bias (VGS,STR); ii) stress time (tSTR); and iii) temperature (T). Attributed to the increased negatively ionized acceptor traps in the buffer
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