Abstract
In this study we expanded on recently reported research by using a modified miniature Charpy impact-testing system to investigate the shear deformation behavior of Sn–3.0Ag–0.5Cu lead-free solder joints at high strain rates ranging from 1.1 × 103 s−1 to 5.5 × 103 s−1. The experimental results revealed that the maximum shear strength of the solder joint decreased with increasing load speed in the ranges tested in this study. For solder joints tested at a shear speed exceeding 1 m/s, corresponding to an approximate strain rate that exceeds 1950 s−1, the brittle fracture mode is the main failure mode, whereas lower strain rates result in a ductile-to-brittle transition in the fracture surfaces of solder joints. In addition, the mode II stress intensity factor (KII) used to evaluate the fracture toughness (KC) of an interfacial intermetallic compound layer between Sn–3.0Ag–0.5Cu solder and the toughness of copper substrate was found to decrease from 1.63 MPa m0.5 to 0.97 MPa m0.5 in the speed range tested here.
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