Abstract
In the electronics industry, it is common to measure the positions of the solder pins of electrical connectors from the bottom using the automated optical inspection (AOI) technique. However, the pins’ surfaces facing the camera of the AOI system may generate image noises, leading to inaccurate measurement results. The objective of the paper is to develop a machine vision system with an algorithm to measure the pin position from the side. Two images must be captured in different view directions so that the algorithm can use the information on the images to calculate the positions of the pins. Comparing the results obtained using the proposed method and those obtained using a 2D vision measuring machine to measure the positions from the bottom, we found that the maximum difference in the results was 0.03 mm. The technique presented in the paper can provide an alternative solution for measuring the positions of the solder pins of electrical connectors or similar components if measurement from the bottom is not feasible.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
