Abstract
Design technology co-optimization (DTCO) has been a workhorse in optimizing logic technology innovations for a few generations now. With increased complexity associated with each new node and the growing number of technological innovations, it is time to expand the conventional DTCO flows. In this article, we present a novel materials to systems co-optimization (MSCO) platform, expanding the boundaries of traditional DTCO to encompass materials modeling to all the way to system design. To demonstrate the application of our MSCO platform, we discuss various front-end-of-line (FEOL) and middle-of-line (MOL)/back-end-of-line (BEOL) technologies and show their impact on device and circuit performance.
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