Abstract
Summary This paper discusses material-removal mechanisms in grinding of ceramics using single-point diamonds and diamond wheels. The ground layers were analyzed using SEM, TEM and other inspection methods. Material pulverization was discovered on the surface layer of ground ceramics. A powder regime was observed which appeared to result from pulverization, which was the dominant material-removal mechanism as long as depth of cut was smaller than a critical value. Material flowed sideways in single-point grinding, forming pile-ups on both sides of a groove. The size of the powder regime and die coefficient of pile-up were measured in various grinding conditions.
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