Abstract

AbstractOur previous study demonstrated that, in a cracked single‐crystal subjected to remote tensile stress, the interactions among material behavior, strain localization, mechanical behavior, and strain concentration caused the formation of a strain field was quite different from the HRR singularity introduced in the homogeneous continuum. Moreover, to quantify strain localization ability for metals, a material index for strain localization susceptibility (SLS) was proposed. However, the effectiveness and availability of that index were not examined in detail. In this study, a Cu‐based single crystal was examined using the crystal‐plasticity finite element method (CPFEM) model. This model incorporates the strain localization mechanism from the non‐crystallographic shear band. Additionally, a new material index for SLS was introduced. The results showed that the new material index could reflect the SLS of the material. Meanwhile, a critical material index value based on strain localization was determined for predicting the crack behavior. This study also discusses the plastic deformation behavior near the crack tip with different material indices for SLS.

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