Abstract
We introduce the Advanced Thin Film Inspection System (ATFIS), a state-of-the-art automatic visual inspection (AVI) system developed by IBM that integrates sophisticated subsystems to inspect advanced multilayer electronic packaging. The image acquisition and 'image segmentation' (material discrimination) is based on a high-radiance illumination, multiband line scan cameras and the Low-level Image Segmentation Architecture (LISA). LISA employs a decision-theoretic approach that classifies pixels according to a decision function defined over a multidimensional 'feature space' (for example, local or global image statistics). The image processing and pattern analysis is based on the Parallel Image Processing System for Inspection (PIPSI) architecture. PIPSI's key features include exploitation of emerging hardware and software technologies; highly programmable to adapt quickly to changing functional requirements; and exploitation of image and operator parallelism, making it highly scalable to meet manufacturing requirements. The pattern analysis algorithm is a synthesis of reference-based comparison and design-rule analysis.
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