Abstract
This paper describes the detailed design of an acoustic emission-based micromachined sensor for smart structures applications to assess in-flight structural integrity. This unique sensor approach combines silicon sensor micromachining, conformal optical waveguide technology, and high-speed optical interconnects to measure acoustic emission event data related to structural failure. A micron-level dual-element micromachined cantilever beam architecture design is described which incorporates conformal on-chip polyimide optical waveguide interconnects to optically sense structural integrity acoustic parameters and route optical power to the sensor assembly. High-speed optical interconnects are used to transfer sensor data to avionic interfaces for debrief and detailed analysis. A detailed design of the optical waveguide sensor design and the significant payoffs and benefits of these sensors are discussed.
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