Abstract
A low-cost multilayer antenna-in-package solution, using the standard printed-circuit-board (PCB) process, is proposed for the 60-GHz-phased array system. The design procedure focuses on overcoming the fabrication restrictions and realizing a low-cost, broadband, compact and reliable package solution. The multilayer stack-up structure consists of three laminates and two bondply layers, with which the antenna element, vertical quasi-coaxial via transition, antenna feedline, power, and low-speed interfaces are realized. An aperture-coupled patch antenna with a compact fan-shaped feeding network and a vertical quasi-coaxial via transition are proposed, fabricated, and measured. For the single antenna element, including the vertical quasi-coaxial via transition, the measured fractional impedance bandwidth ( $\vert \text{S}11\vert dB) is 20.2%, and the measured peak gain is 6.9 dBi at 62 GHz. Based on the single antenna, a 16-element antenna package is realized in the dimension of 14 mm $\times14$ mm $\times0.925$ mm. Measurements show that each antenna element achieves a $\vert \text{S}11\vert $ less than −10 dB from 57.2 to 64.5 GHz, 4–7.5 dBi gain across all four IEEE 802.15.3c channels.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
