Abstract

The increasing demands for electronic packing materials necessitate stringent criteria for the overall properties of cyanate ester (CE) resins. In this work, a novel linear polyborosiloxane with a distinctive organic-inorganic hybrid Si–O–B backbone, featuring functional epoxy and phenyl groups (denoted as LPSi-B), was synthesized via a solvent- and catalyst-free one-pot polycondensation. Subsequently, the synthesized LPSi-B was co-crosslinked within the bisphenol A dicyanate ester (BADCy) thermoset network. The presence of abundant active epoxy groups in LPSi-B facilitated its involvement in the cyanate curing reaction, demonstrating excellent compatibility within the resin matrix. The resulting LPSi-B/BADCy composite not only exhibits outstanding mechanical properties but also demonstrates notable flame-retardant and dielectric characteristics. Specifically, the hybrid nature of LPSi-B, combining the flexibility of Si–O–B chains with the rigidity of side-chain phenyl groups, fosters intermolecular non-covalent π-π interactions directly linked to boron atoms, thus mitigating network polarization. Furthermore, the synergistic flame-retardant effect arising from boron and silicon components was harnessed to achieve halogen-free, phosphorus-free, and environmentally friendly fire safety outcomes. This innovative design ensures exceptional compatibility and interface bonding between LPSi-B and the polymer matrix, thereby endowing cyanate ester resin with superior comprehensive performance suitable for advanced applications in wave-transparent and electronic packing materials.

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