Abstract
This paper presents an alternative adhesive bonding system which is able to join very small parts as well as relatively large parts with high accuracy requirements. The main advantages are the possibility to apply small volumes, to preapply the adhesive with a temporarily delayed joining procedure and extremely short set cycles. The center of micro joining develops suitable joining techniques on the basis of non-viscous adhesive systems (hot melts). The process development focuses on the suitability for automation, process times and the applicability of batch processes. The article discusses certain hot melt application techniques that are suitable for batch production e. g. the laser-sintering of hot melt powder, presents an adapted assembly system and shows an example of an automated assembly process for hot melt coated micro components. Therefore, using hot melts can be a technologically and economically interesting alternative for the assembly and packaging of MEMS.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
