Abstract
ABSTRACTIn the Laser Chemistry Group's program aimed at understanding the basic mechanisms involved in the fabrication and characterization of integrated circuits, we have converted an infrared laser-based, thick film trimming technique, which is over 15 years old, to UV light. It is known that excimer lasers can be used for microfabrication of semiconductors and ceramics. Much cleaner ablations than those obtainable with the infrared lasers have been demonstrated in a large variety of materials. This, together with the fact that excimers with repetition rates over 1 kHz are presently on the market, leads us to propose that better accuracies and smaller drifts, should be achievable using excimer laser-based thick film hybrid circuit trimming. Results of XeCl laser trimming of over four hundred resistors, including temperature coefficient of resistance measurements and life tests at elevated temperatures, demonstrate that UV trimming is a factor of 10 better than the presently used infrared process.
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