Abstract
Tape Automated Bonding (TAB) is a modern technology which meets the requirements for micronnecting VLSI-circuits. Gang bonding with a thermode is the usually applied bond technique. The limitations for gang bonding of chips with high lead counts are the increased bond forces and the induced mechanical stress. Laser soldering is an alternative for inner lead bonding chips with high lead counts and reduced pitch. Because the microjoining of surfaces occurs via thermal energy from the laser beam, no mechanical pressure is necessary for laser soldering. Due to the optical properties of the laser beam and the possibility to reduce the laser spot, soldering of small pitches is possible.
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