Abstract
Herein we present a pulsed laser processing method for crystallization and dopant activation of a highly n-doped amorphous silicon (a-Si:H) carrier selective layer for high conductivity, high carrier lifetime, low emitter saturation current and limited surface layer heating as opposed to high temperature furnace annealing induced heating of the bulk Si wafer. We demonstrate increased crystallinity and reduced layer resistivity, without impacting surface passivation quality. Additionally, we examine the role of forming gas annealing (FGA) on further improving the passivation of laser-processed polysilicon layers to achieve a OC ), and 27 fA/cm2 recombination current density (J 0 ) with the potential for further passivation improvement via laser process optimization.
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