Abstract
AbstractPulsed‐laser‐induced removal of particles from surfaces is a new cleaning technique. This laser cleaning can be performed on dry surfaces as well as on wet surfaces with a micron‐thick liquid film during pulsed laser irradiation to provide enhanced removal efficiency. Using the latter technique, to be called ‘steam laser cleaning’ here, we are able to remove epoxy, alumina, silicon or gold particles with diameters in the range 0.1–10 μm from silicon and other surfaces.
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