Abstract

Laminated composites are of great interest in different industries while having the advantages of all base metals. In this research, the laser bending of a three-layered SUS430/C11000/SUS430 laminated composite is characterized both experimentally and numerically. This composite can be used in the microelectronics industry since it has the anti-corrosion and strength capability of stainless steel, and the electrical superiority of copper. The specimens are bent using a Ytterbium fiber laser irradiated on a straight path along the sheet width. The effects of bending parameters including the number of passes, scanning velocity, beam diameter, laser power and delay time between passes are examined for a three-layered laminated sheet, and compared with its constituent steel and copper layers. It is found that the thin copper mid-layer strongly affects the rate of bending per pass. Heat distribution and plastic strain along the thickness during the process are characterized by using the finite element method. The Cu mid-layer decreases the bending angle, but also postpones the onset of melting, and thus can be compensated by the application of higher laser powers. It is shown that the bending angle increases with an increase in laser power and delay time, and a decrease in laser velocity and beam diameter.

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