Abstract
Experimental results are presented on spatially confined damage of Hg x Cd 1- x Te induced by a copper-vapor laser beam under a layer of either a Br-containing liquid or a chemically neutral liquid (H 2O, DMFA, DMSO). Engraved grooves have a triangular profile with a minimal width of 5 μm. The thickness of the nonstoichiometric layer of s/c is about a few μm. Via-holes produced in the s/c under a layer of liquid containing organometallic molecules (soluble compounds of Au, W, Mo) provide the interconnection of two sides of a s/c wafer with a DC resistance of 5 Ω at 77 K.
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