Abstract

High dielectric constant polymer composites have considerable potentials in energy storage and dielectric applications because of simple fabrication process, facile processability, light-weight, excellent thermal stability and mechanical properties. Perovskite (CsPbBr3)/polyimide (PI) composites were successfully prepared via an in-situ polymerization from CsPbBr3 precursor in polyamic acid, followed by thermal imidization. The dielectric properties of polyimide composites were controlled by adjusting the content of CsPbBr3 nanocrystals. The obtained CsPbBr3/PI composites not only possess a high dielectric constant of up to 25.5 but also exhibit low dielectric loss below 0.25. The maximal discharging energy density reached up to 3.10 J cm−3 with 10% CsPbBr3, which is almost 3 times greater than pure PI under the same conditions. In addtiton, outstanding thermal properties of 5% decomposition temperature beyond 530 °C and good mechanical properties. The CsPbBr3/PI composites can be prepared facilely and rapidly on a large scale, which will be a outstanding dielectric material for high temperature polymer film capacitors.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.