Abstract
We describe the design, fabrication and demonstration of a terahertz sensor array module, designed to operate over 250-350GHz. The antenna coupled microbolometer was fabricated on a glass substrate with an integrated array of pixel switches and row multiplexing circuitry implemented with LTPS (Low Temperature PolySilicon) thin film transistors. While other microbolometer arrays have been reported for the upper Terahertz bands, we focus on lower frequencies where adequate semiconductor sources are available potentially enabling important medical and security applications. The devices were fabricated in a Gen 3.5 flat panel manufacturing facility implementing what we call Large Area MEMS Platform (LAMP) surface micromachining process, providing a path to low-cost manufacturing. Individual pixels were defined on a 0.7mm pitch across an array of 128x128 pixels in this first demonstration. Since flat panel fabrication capabilities use large, single-shot reticle masks and large glass substrates, physically larger arrays can be manufactured without mask stitching. An ROIC (readout integrated circuit) was demonstrated to support the THz sensor panel with 648 input channels, each providing an independent sigma delta ADC with excellent uniformity and 12 effective number of bits. An early demonstration of the sensor array is described, imaging a metallic knife hidden in a cardboard envelope.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Terahertz Science and Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.