Abstract
In this work, the authors will review the laser operation and imaging fundamentals behind a new method of alternating wavelengths in a single exposure and the application to Customer use cases. Two focal positions are created that are averaged over the exposure field, which can be turned on and off, thus eliminating any potential scanner calibration issues. The main focus of this work is the application of this imaging method (single exposure with two focus positions) to significantly improve the sidewall angle linearity of features in extremely thick photoresist applications. This novel technique, called MFI (multi-focal imaging), can be tuned specifically to provide the required amount of focus offset for a specific thick photoresist application. There are several Customer use cases that have been evaluated in simulation and demonstrated on wafer.
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