Abstract
Tantalum nitride (TaN) thin films with different thicknesses were deposited by reactive sputtering technology as a function of N 2 /Ar flow ratio. Film microstructure was investigated by X-ray diffraction (XRD), and surface roughening was analyzed by atomic force microscopy and dynamic scaling theory. With increasing N 2 /Ar flow ratio, the film structure changes from polycrystalline to amorphous. With increasing N 2 /Ar flow ratio, film surface roughness first decreases and then increases, and the evolution of growth exponent β exhibits the similar behavior. However, the roughness exponent α first increases and then decreases. The influence of microstructure and growth process on kinetic surface roughening of the films was discussed.
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