Abstract
Conditioning is the process of removing the glazing area from a polishing pad surface and restoring the quality of the surface to maintain a stable polishing performance. However, the conditioning process can induce a non-uniform profile variation of the pad, which can result in nonuniform material removal rates across the wafer. In this paper, a kinematical model based on Preston's equation is proposed to examine the pad profile variation (PPV) induced by swing arm conditioning with a diamond disk. The proposed model was simulated with various swing arm velocity profiles (SAVPs), and the results were compared with experimental results. The results showed the relationship between kinematical parameters and the PPV. The PPV was proportional to sliding distance based on the kinematical model, and then the sliding distance distribution across the pad was dependent on the SAVP. This study has proven the effectiveness of the kinematical model on the PPV during conditioning in chemical mechanical polishing (CMP).
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
