Abstract
The article deals with forming solid joints of Low Temperature Co-fired Ceramic with Alumina or Silicon Carbide chips. The aim of this study is to find material of standard thick film layer process, which would be useful for electronic chip packages designed for higher operating temperatures (from 150 up to 800 °C). Heraeus Hera Lock 2000 Low Temperature Co-fired Ceramics (LTCC) was chosen, because of its nearly zero shrinkage during firing. Also other LTCC types were used to comparison of results. Conductive and isolating thick film pastes are used for joining. Temperature cycling of samples was applied. Strength of cycled samples was investigated by mechanical shear tests. The structure of microsection of joints was analyzed using optical and scanning electron microscope. The results show that thick film pastes are usable for joining above mentioned materials in specific temperature range.
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