Abstract
In this article, the development of mechanical characteristics evaluation technique for FIB-processed nanostructures is described. We designed the on-chip tensile testing device, which consists of a nano-specimen, electrostatic actuator for stretching the specimen, and capacitance sensor for measuring tensile displacement. A theoretical resolution of 1 nm in tensile displacement was achieved. The uniaxial tensile force was derived using the spring constant of suspended beams with theoretical resolution of 15 nN. In addition, we developed a new nano-testing technique that is the combination of on-chip tensile testing device and nano-sampling technique using FIB. By using the technique, the Young's modulus of Si nanowire was measured to be 168.8 GPa, which is close to the ideal value of SCS (001)[110]. The tensile strength was 8.3 GPa, indicating that there is a size effect on the strength.
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