Abstract
γ'-strengthened Co-based superalloy is bonded by a Transient liquid phase bonding process using the Ni-Cr-W-B filler alloy, and the solidification behavior of the joint is studied by using in-situ microstructure characterization and computer simulation. Results indicate the isothermal solidification layer is composed of γ'/γ phase, and the solid/liquid interface is prone to grow with cellular morphology due to the large compositional undercooling zone caused by the rapid diffusion of B. The athermally solidified zone is composed of the γ phase, M3B2, MB, and M23B6. The solidification sequence is that: γ + M3B2 eutectic, γ + MB eutectic, and the γ + CrB + M23B6 ternary eutectic. The formation of the M23B6 instead of the theoretically predicted Ni3B in the ternary eutectic is mainly because the Al, Cr, Co, and Ta elements do not diffuse sufficiently and are left in the residual liquid. These elements make the formation energy of the M23B6 lower than that of the M3B. Our experimental results help to understand the microstructural characteristics better and serve as a guide for further optimizing the microstructure of the TLP joint.
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