Abstract
Thermal conductivity is a key property in many applications from electronic to informatics. The interaction of fillers with Sylgard 184 was studied; this study explores new composites and the influence of metal particles (copper and nickel), carbon-based materials (carbon nanotubes and carbon black), and ceramic nanoparticles (boron nitride) as fillers to enhance thermal properties of silicon-based composites. The effect of the fillers on the final performances of the composite materials was evaluated. The influence of filler volume, dimension, morphology, and chemical nature is studied. Specifically, FT-IR analysis was used to evaluate curing of the polymer matrix. DSC was used to confirm the data and to further characterize the composites. Thermo-mechanical properties were studied by DMTA. The filler morphology was analyzed by SEM. Finally, thermal conductivity was studied and compared, enlightening the correlation with the features of the fillers. The results demonstrate a remarkable dependence among the type, size, and shape of the filler, and thermal properties of the composite materials. Underlining a that the volume filler influenced the thermal conductivity obtaining the best results with the highest added volume filler and higher positive impact on the k of the composites is reached with large particles and with irregular shapes. In contrast, the increase of filler amount affects the rigidity of the silicon-matrix, increasing the rigidity of the silicon-based composites.
Highlights
Polymeric materials have been widely employed in electronic packaging, batteries, cable terminations, and power devices
The best formulation in terms of workability for carbon black was 4.4% we selected the same maximum content for boron nitride, with this filler it was possible to further increase the content up to 6.6 vol% still keeping a good viscosity of the formulation
This study showed higher % increment respect to the pristine matrix if compared with the previous data cited in literature and report a new composite considering the PDMS as polymer matrix
Summary
Polymeric materials have been widely employed in electronic packaging, batteries, cable terminations, and power devices. Thermal loading in these applications has become a critical issue for the further development of electronic devices. PDMS are widely used in TIM applications [1,3,4,5,6,7] due to their high flexibility and thermal stability. They possess low thermal conductivity (k) which may limit their application in devices. The value usually varies from 0.1 to 0.5 Wm−1 K−1 according to the different polymeric matrix [8,9]
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