Abstract
The reliability of InP/InGaAs DHBT under high collector current densities and low junction temperatures is analyzed and modeled. From the Gummel characteristics, we observe several types of device degradation, resulting from the long term changes of base and collector current in both lower and higher base–emitter voltage ranges which impacts the reduction of DC current gain. In this paper, we investigate the underlying physical mechanism of base and collector current degradation with the help of TCAD device simulation. We chose the HICUM model level2 for the modeling purpose to evaluate the drift of model parameters according to stress time. The evolution of the model parameters is described with suitable equations to achieve a physics based compact electrical aging model. The aging laws and the parameter evolution equations with stress time are implemented in compact electrical aging model which allows us to simulate the impact of device failure mechanisms on the circuit in operating conditions.
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